型号:

BBL-123-G-F

RoHS:无铅 / 符合
制造商:Samtec Inc描述:CONN HEADR LOPRO 23POS .100 GOLD
详细参数
数值
产品分类 连接器,互连式 >> 板至板 - 接头,公引脚
BBL-123-G-F PDF
产品培训模块 Board-to-Board Connectors
产品目录绘图 BBL-xxx-G-F Series
特色产品 Board-To-Board Interconnect Systems
标准包装 1
系列 BBL
连接器类型 无罩
位置数 23
加载位置的数目 全部
间距 0.100"(2.54mm)
行数 1
行间距 -
高度堆叠(配接) -
超出电路板的模制高度 0.085"(2.16mm)
触点接合长度 0.122"(3.10mm)
安装类型 通孔
端子 焊接
触点表面涂层
触点涂层厚度 20µin(0.51µm)
特点 -
颜色
包装 散装
配套产品 SAM1110-23-ND - CONN RCPT .100" 23POS TIN PCB
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SAM1106-23-ND - CONN RCPT .100" 23POS GOLD PCB
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SAM1103-23-ND - CONN RCPT .100" 23POS GOLD PCB
SAM1102-23-ND - CONN RCPT .100" 23POS GOLD PCB
其它名称 SAM1001-23
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